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MC33PF8200DNES

Power management

    NXP USA Inc.BrandedMC33PF8200DNESIntegrated circuit electronic chips use260Encapsulated, with a working temperature range of-40°C ~ 105°C（TA）,The voltage is2.5V ~ 5.5V,use56-VFQFN 裸露焊盘Packaging technology，nowMC33PF8200DNESChip inventory is11344individual。
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Power management

MC33PF8200DNES
查看电源型号为MC33PF8200DNES，品牌为NXP的大图  
 
MC33PF8200DNES     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MC33PF8200DNES
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   11344
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Characteristic    
Minqty   260
Series   POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging and Encapsulation   56-VFQFN 裸露焊盘
Supply Voltage   2.5V ~ 5.5V
Operation Temperature   -40°C ~ 105°C（TA）
Describe  
 
基于高性能 i.MX 8，S32x 处理器
 
 
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