MC33PF8200DHES
Power management
NXP USA Inc.BrandedMC33PF8200DHESIntegrated circuit electronic chips use260Encapsulated, with a working temperature range of-40°C ~ 105°C（TA）,The voltage is2.5V ~ 5.5V,use56-VFQFN 裸露焊盘Packaging technology，nowMC33PF8200DHESChip inventory is12419individual。
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