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MC33PF8200DFES

Power management

    NXP USA Inc.BrandedMC33PF8200DFESIntegrated circuit electronic chips use260Encapsulated, with a working temperature range of-40°C ~ 105°C(TA),The voltage is2.5V ~ 5.5V,use56-VFQFN 裸露焊盘Packaging technology,nowMC33PF8200DFESChip inventory is13547individual。
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Power management

MC33PF8200DFES

查看电源型号为MC33PF8200DFES,品牌为NXP的大图  
 
MC33PF8200DFES     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MC33PF8200DFES
Brand   NXP
Manufacturer   NXP USA Inc.
PDF   Viewing PDF files
Inventory quantity   13547
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Characteristic    
Minqty   260
Series   I.MX8QXP WITH DDR3L
Packaging and Encapsulation   56-VFQFN 裸露焊盘
Supply Voltage   2.5V ~ 5.5V
Operation Temperature   -40°C ~ 105°C(TA)
Describe  
 
基于高性能 i.MX 8,S32x 处理器
 
 
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