MM9Z1J638BM2EP
Power management
NXP USA Inc.BrandedMM9Z1J638BM2EPIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of-40°C ~ 125°C(TJ),The voltage is,use48-VFQFN 裸露焊盘Packaging technology,nowMM9Z1J638BM2EPChip inventory is10358individual。
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