Image


LM3209-G3

Power management

    Texas InstrumentsBrandedLM3209-G3Integrated circuit electronic chips useDSBGA|12Encapsulated, with a working temperature range of-30 to 85,The voltage is,use4 mm2: 1.8 x 2 (DSBGA|12)Packaging technology，nowLM3209-G3Chip inventory is18201individual。
---
 
Power management

LM3209-G3
查看电源型号为LM3209-G3，品牌为TI的大图  
 
LM3209-G3     There is sufficient supply and supply is ongoing...
Chip Information    
Model   LM3209-G3
Brand  
Manufacturer   Texas Instruments
PDF   Viewing PDF files
Inventory quantity   18201
 Inquiry Now
Characteristic    
Minqty   DSBGA|12
Series   Seamless Transition Buck-Boost DC/DC regulator for RF Power Amplifiers
Packaging and Encapsulation   4 mm2: 1.8 x 2 (DSBGA|12)
Operation Temperature   -30 to 85
LAB/CCB   Ordering & quality
Number of Logical ElementsUunits   Buck converters (integrated switch)
Total RAM Bits   Catalog
Describe  
 
 
 
  •               Previous article
    TPS61166
    Texas Instruments
  •               Next article
    LM5060
    Texas Instruments
    •  
     
    BRAND
     
  •  
    Maxim
    1
     
     
  •  
    ALTERA
    2
     
     
  •  
    NXP Semiconductors
    3
     
     
  •  
    Microchip
    4
     
     
  •  
    Analog Devices Inc
    5
     
     
  •  
    STMicroelectronics
    6
     
     
  •  
    XILINX
    7
     
     
  •  
    BROADCOM
    8
     
     
  •  
    Silicon Labs
    9
     
     
  •  
    Texas Instruments
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd