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LM3279

Power management

    Texas InstrumentsBrandedLM3279Integrated circuit electronic chips useDSBGA|16Encapsulated, with a working temperature range of-30 to 85,The voltage is,use6 mm2: 2.3 x 2.5 (DSBGA|16)Packaging technology，nowLM3279Chip inventory is11146individual。
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Power management

LM3279
查看电源型号为LM3279，品牌为TI的大图  
 
LM3279     There is sufficient supply and supply is ongoing...
Chip Information    
Model   LM3279
Brand  
Manufacturer   Texas Instruments
PDF   Viewing PDF files
Inventory quantity   11146
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Characteristic    
Minqty   DSBGA|16
Series   Buck-Boost Converter with MIPI® RFFE Interface for 3G and 4G RF Power Amplifiers
Packaging and Encapsulation   6 mm2: 2.3 x 2.5 (DSBGA|16)
Operation Temperature   -30 to 85
LAB/CCB   Ordering & quality
Number of Logical ElementsUunits   Buck converters (integrated switch)
Total RAM Bits   Catalog
Describe  
 
 
 
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