Image


DS90LV001

Interface

    Texas InstrumentsBrandedDS90LV001Integrated circuit electronic chips useSOIC|8, WSON|8Encapsulated, with a working temperature range of-40 to 85,The voltage is,use19 mm2: 3.91 x 4.9 (SOIC|8), 9 mm2: 3 x 3 (WSON|8)Packaging technology，nowDS90LV001Chip inventory is12020individual。
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Interface

DS90LV001
查看接口型号为DS90LV001，品牌为TI的大图  
 
DS90LV001     There is sufficient supply and supply is ongoing...
Chip Information    
Model   DS90LV001
Brand  
Manufacturer   Texas Instruments
PDF   Viewing PDF files
Inventory quantity   12020
 Inquiry Now
Characteristic    
Minqty   SOIC|8, WSON|8
Series   800-Mbps LVDS buffer
Packaging and Encapsulation   19 mm2: 3.91 x 4.9 (SOIC|8), 9 mm2: 3 x 3 (WSON|8)
Operation Temperature   -40 to 85
LAB/CCB   Ordering & quality
Number of Logical ElementsUunits   LVDS, M-LVDS & PECL ICs
Total RAM Bits   Catalog
Describe  
 
 
 
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