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4DB0226KA3AVG

Die&wafer services

    Renesas Electronics America IncBranded4DB0226KA3AVGIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of-,The voltage is-,use53-TFBGA，FCCSPPackaging technology，now4DB0226KA3AVGChip inventory is13930individual。
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Die&wafer services

4DB0226KA3AVG
查看芯片与晶圆服务型号为4DB0226KA3AVG，品牌为Renesas的大图  
 
4DB0226KA3AVG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   4DB0226KA3AVG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   13930
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Characteristic    
Minqty   1
Series   IC DDR4 DATA BUFFER 53FCCCSP
Packaging and Encapsulation   53-TFBGA，FCCSP
Supply Voltage   -
Operation Temperature   -
Describe  
 
 
 
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