Image


4DB0226KB0AVG

Die&wafer services

    Renesas Electronics America IncBranded4DB0226KB0AVGIntegrated circuit electronic chips use364Encapsulated, with a working temperature range of-,The voltage is1.2V,use53-TFBGA,FCCSPPackaging technology,now4DB0226KB0AVGChip inventory is15496individual。
---
 
Die&wafer services

4DB0226KB0AVG

查看芯片与晶圆服务型号为4DB0226KB0AVG,品牌为Renesas的大图  
 
4DB0226KB0AVG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   4DB0226KB0AVG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   15496
 Inquiry Now
Characteristic    
Minqty   364
Series   FCCSP 7.50X3.00X1.20 MM, 0.50MM
Packaging and Encapsulation   53-TFBGA,FCCSP
Supply Voltage   1.2V
Operation Temperature   -
Describe  
 
 
 
  •               Previous article
    DS1312S-2+T&R
    Analog Devices Inc./Maxim Integrated
    非易失性 RAM
  •               Next article
    4DB0232KC2AVG
    Renesas Electronics America Inc
    动态 RAM(DRAM)
  •  
     
    BRAND
     
  •  
    ON Semiconductor
    1
     
     
  •  
    Analog Devices Inc
    2
     
     
  •  
    NXP Semiconductors
    3
     
     
  •  
    XILINX
    4
     
     
  •  
    STMicroelectronics
    5
     
     
  •  
    Silicon Labs
    6
     
     
  •  
    BROADCOM
    7
     
     
  •  
    Maxim
    8
     
     
  •  
    Texas Instruments
    9
     
     
  •  
    ALTERA
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd