Image


70T3509MS166BPI

Die&wafer services

    Renesas Electronics America IncBranded70T3509MS166BPIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use256-BGAPackaging technology,now70T3509MS166BPIChip inventory is19341individual。
---
 
Die&wafer services

70T3509MS166BPI

查看芯片与晶圆服务型号为70T3509MS166BPI,品牌为Renesas的大图  
 
70T3509MS166BPI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3509MS166BPI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19341
 Inquiry Now
Characteristic    
Minqty   1
Series   IC RAM
Packaging and Encapsulation   256-BGA
Describe  
 
 
 
  •               Previous article
    70P27L15PFG
    Renesas Electronics America Inc
    SRAM - 双端口,异步...
  •               Next article
    70V05L12PF8
    Renesas Electronics America Inc
    SRAM - 双端口,异步...
  •  
     
    BRAND
     
  •  
    XILINX
    1
     
     
  •  
    Microchip
    2
     
     
  •  
    Texas Instruments
    3
     
     
  •  
    ON Semiconductor
    4
     
     
  •  
    ALTERA
    5
     
     
  •  
    NXP Semiconductors
    6
     
     
  •  
    BROADCOM
    7
     
     
  •  
    STMicroelectronics
    8
     
     
  •  
    Analog Devices Inc
    9
     
     
  •  
    Maxim
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd