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RMLV0816BGSD-4S2&HA1

Die&wafer services

    Renesas Electronics America IncBrandedRMLV0816BGSD-4S2&HA1Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use52-TFSOP（0.350"，8.89mm 宽）Packaging technology，nowRMLV0816BGSD-4S2&HA1Chip inventory is18582individual。
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Die&wafer services

RMLV0816BGSD-4S2&HA1
查看芯片与晶圆服务型号为RMLV0816BGSD-4S2&HA1，品牌为Renesas的大图  
 
RMLV0816BGSD-4S2&HA1     There is sufficient supply and supply is ongoing...
Chip Information    
Model   RMLV0816BGSD-4S2&HA1
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   18582
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Characteristic    
Minqty   1
Series   IC SRAM 8MBIT PARALLEL 52TSOP II
Packaging and Encapsulation   52-TFSOP（0.350"，8.89mm 宽）
Describe  
 
 
 
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