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70T3519S166DRI

Die&wafer services

    Renesas Electronics America IncBranded70T3519S166DRIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use208-BFQFPPackaging technology，now70T3519S166DRIChip inventory is14380individual。
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Die&wafer services

70T3519S166DRI
查看芯片与晶圆服务型号为70T3519S166DRI，品牌为Renesas的大图  
 
70T3519S166DRI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3519S166DRI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   14380
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Characteristic    
Minqty   1
Series   IC SRAM 9MBIT PARALLEL 208PQFP
Packaging and Encapsulation   208-BFQFP
Describe  
 
 
 
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