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ECB130ABDCN-Y3

Die&wafer services

    Micron Technology Inc.BrandedECB130ABDCN-Y3Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use-Packaging technology，nowECB130ABDCN-Y3Chip inventory is15457individual。
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Die&wafer services

ECB130ABDCN-Y3
查看芯片与晶圆服务型号为ECB130ABDCN-Y3，品牌为Micron的大图  
 
ECB130ABDCN-Y3     There is sufficient supply and supply is ongoing...
Chip Information    
Model   ECB130ABDCN-Y3
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   15457
 Inquiry Now
Characteristic    
Minqty   1
Series   LPDDR2 1G DIE 32MX32
Packaging and Encapsulation   -
Describe  
 
 
 
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