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MT29F256G08CBCBBL06B3WC1

Die&wafer services

    Micron Technology Inc.BrandedMT29F256G08CBCBBL06B3WC1Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use模具Packaging technology,nowMT29F256G08CBCBBL06B3WC1Chip inventory is12595individual。
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Die&wafer services

MT29F256G08CBCBBL06B3WC1

查看芯片与晶圆服务型号为MT29F256G08CBCBBL06B3WC1,品牌为Micron的大图  
 
MT29F256G08CBCBBL06B3WC1     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MT29F256G08CBCBBL06B3WC1
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   12595
 Inquiry Now
Characteristic    
Minqty   1
Series   IC FLASH 256GBIT PARALLEL DIE
Packaging and Encapsulation   模具
Describe  
 
 
 
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