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MT29E3T08EQHBBG2-3:B

Die&wafer services

    Micron Technology Inc.BrandedMT29E3T08EQHBBG2-3:BIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use272-LFBGAPackaging technology，nowMT29E3T08EQHBBG2-3:BChip inventory is15040individual。
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Die&wafer services

MT29E3T08EQHBBG2-3:B
查看芯片与晶圆服务型号为MT29E3T08EQHBBG2-3:B，品牌为Micron的大图  
 
MT29E3T08EQHBBG2-3:B     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MT29E3T08EQHBBG2-3:B
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   15040
 Inquiry Now
Characteristic    
Minqty   1
Series   IC FLASH 3TBIT PAR 272LFBGA
Packaging and Encapsulation   272-LFBGA
Describe  
 
 
 
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