Image


LE2464RDXATDG

Die&wafer services

    onsemiBrandedLE2464RDXATDGIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use6-XFBGA,WLCSPPackaging technology,nowLE2464RDXATDGChip inventory is18124individual。
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Die&wafer services

LE2464RDXATDG

查看芯片与晶圆服务型号为LE2464RDXATDG,品牌为onsemi的大图  
 
LE2464RDXATDG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   LE2464RDXATDG
Brand   onsemi
Manufacturer   onsemi
PDF   Viewing PDF files
Inventory quantity   18124
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Characteristic    
Minqty   1
Series   IC EEPROM 64KBIT I2C 1MHZ 6WLCSP
Packaging and Encapsulation   6-XFBGA,WLCSP
Describe  
 
 
 
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