Image


LE2464DXATBG

Die&wafer services

    onsemiBrandedLE2464DXATBGIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use6-XFBGA,WLCSPPackaging technology,nowLE2464DXATBGChip inventory is17709individual。
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Die&wafer services

LE2464DXATBG

查看芯片与晶圆服务型号为LE2464DXATBG,品牌为onsemi的大图  
 
LE2464DXATBG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   LE2464DXATBG
Brand   onsemi
Manufacturer   onsemi
PDF   Viewing PDF files
Inventory quantity   17709
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Characteristic    
Minqty   1
Series   IC EEPROM 64KBIT I2C 1MHZ 6WLCSP
Packaging and Encapsulation   6-XFBGA,WLCSP
Describe  
 
 
 
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