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S25FL164K0XBHVS30

Die&wafer services

    Infineon TechnologiesBrandedS25FL164K0XBHVS30Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use24-TBGAPackaging technology,nowS25FL164K0XBHVS30Chip inventory is12377individual。
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Die&wafer services

S25FL164K0XBHVS30

查看芯片与晶圆服务型号为S25FL164K0XBHVS30,品牌为Infineon的大图  
 
S25FL164K0XBHVS30     There is sufficient supply and supply is ongoing...
Chip Information    
Model   S25FL164K0XBHVS30
Brand   Infineon
Manufacturer   Infineon Technologies
PDF   Viewing PDF files
Inventory quantity   12377
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Characteristic    
Minqty   1
Series   IC FLASH 64MBIT SPI/QUAD 24BGA
Packaging and Encapsulation   24-TBGA
Describe  
 
 
 
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