Image


70T633S10BFG8

Die&wafer services

    Renesas Electronics America IncBranded70T633S10BFG8Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use208-LFBGAPackaging technology，now70T633S10BFG8Chip inventory is10157individual。
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Die&wafer services

70T633S10BFG8
查看芯片与晶圆服务型号为70T633S10BFG8，品牌为Renesas的大图  
 
70T633S10BFG8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T633S10BFG8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   10157
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Characteristic    
Minqty   1
Series   IC SRAM 9MBIT PARALLEL 208CABGA
Packaging and Encapsulation   208-LFBGA
Describe  
 
 
 
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