Image


70P259L90BYGI

Die&wafer services

    Renesas Electronics America IncBranded70P259L90BYGIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use100-TFBGAPackaging technology,now70P259L90BYGIChip inventory is16288individual。
---
 
Die&wafer services

70P259L90BYGI

查看芯片与晶圆服务型号为70P259L90BYGI,品牌为Renesas的大图  
 
70P259L90BYGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70P259L90BYGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   16288
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 128KBIT PAR 100CABGA
Packaging and Encapsulation   100-TFBGA
Describe  
 
 
 
  •               Previous article
    7027S55PFI8
    Renesas Electronics America Inc
    SRAM - 双端口,异步...
  •               Next article
    CY7C1383F-133BZI
    Infineon Technologies
    SRAM - 同步,SDR
  •  
     
    BRAND
     
  •  
    Silicon Labs
    1
     
     
  •  
    Texas Instruments
    2
     
     
  •  
    STMicroelectronics
    3
     
     
  •  
    Analog Devices Inc
    4
     
     
  •  
    NXP Semiconductors
    5
     
     
  •  
    Maxim
    6
     
     
  •  
    ON Semiconductor
    7
     
     
  •  
    ALTERA
    8
     
     
  •  
    Microchip
    9
     
     
  •  
    BROADCOM
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd