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70P259L65BYGI

Die&wafer services

    Renesas Electronics America IncBranded70P259L65BYGIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use100-TFBGAPackaging technology,now70P259L65BYGIChip inventory is13729individual。
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Die&wafer services

70P259L65BYGI

查看芯片与晶圆服务型号为70P259L65BYGI,品牌为Renesas的大图  
 
70P259L65BYGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70P259L65BYGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   13729
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Characteristic    
Minqty   1
Series   IC SRAM 128KBIT PAR 100CABGA
Packaging and Encapsulation   100-TFBGA
Describe  
 
 
 
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