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70P254L55BYGI

Die&wafer services

    Renesas Electronics America IncBranded70P254L55BYGIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use81-TFBGAPackaging technology,now70P254L55BYGIChip inventory is15838individual。
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Die&wafer services

70P254L55BYGI

查看芯片与晶圆服务型号为70P254L55BYGI,品牌为Renesas的大图  
 
70P254L55BYGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70P254L55BYGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   15838
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Characteristic    
Minqty   1
Series   IC SRAM 128KBIT PARALLEL 81CABGA
Packaging and Encapsulation   81-TFBGA
Describe  
 
 
 
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