Image


70P244L55BYGI8

Die&wafer services

    Renesas Electronics America IncBranded70P244L55BYGI8Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use81-TFBGAPackaging technology,now70P244L55BYGI8Chip inventory is12171individual。
---
 
Die&wafer services

70P244L55BYGI8

查看芯片与晶圆服务型号为70P244L55BYGI8,品牌为Renesas的大图  
 
70P244L55BYGI8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70P244L55BYGI8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   12171
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 64KBIT PARALLEL 81CABGA
Packaging and Encapsulation   81-TFBGA
Describe  
 
 
 
  •               Previous article
    MT53B128M32D1DS-062 AIT:A
    Micron Technology Inc.
    SDRAM - Mobile LPDDR4...
  •               Next article
    CY7C136E-55NXCT
    Infineon Technologies
    SRAM - 双端口,异步...
  •  
     
    BRAND
     
  •  
    Maxim
    1
     
     
  •  
    NXP Semiconductors
    2
     
     
  •  
    Microchip
    3
     
     
  •  
    XILINX
    4
     
     
  •  
    BROADCOM
    5
     
     
  •  
    Analog Devices Inc
    6
     
     
  •  
    Texas Instruments
    7
     
     
  •  
    ON Semiconductor
    8
     
     
  •  
    ALTERA
    9
     
     
  •  
    Silicon Labs
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd