M29F200FB55N3E2
Die&wafer services
Micron Technology Inc.BrandedM29F200FB55N3E2Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowM29F200FB55N3E2Chip inventory is17458individual。
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