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M29F160FB55N3E2

Die&wafer services

    Micron Technology Inc.BrandedM29F160FB55N3E2Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowM29F160FB55N3E2Chip inventory is10859individual。
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Die&wafer services

M29F160FB55N3E2
查看芯片与晶圆服务型号为M29F160FB55N3E2，品牌为Micron的大图  
 
M29F160FB55N3E2     There is sufficient supply and supply is ongoing...
Chip Information    
Model   M29F160FB55N3E2
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   10859
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Characteristic    
Minqty   1
Series   IC FLASH 16MBIT PAR 48TSOP I
Packaging and Encapsulation   48-TFSOP（0.724"，18.40mm 宽）
Describe  
 
 
 
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