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M29DW323DB70N3E

Die&wafer services

    Micron Technology Inc.BrandedM29DW323DB70N3EIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowM29DW323DB70N3EChip inventory is13232individual。
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Die&wafer services

M29DW323DB70N3E
查看芯片与晶圆服务型号为M29DW323DB70N3E，品牌为Micron的大图  
 
M29DW323DB70N3E     There is sufficient supply and supply is ongoing...
Chip Information    
Model   M29DW323DB70N3E
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   13232
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Characteristic    
Minqty   1
Series   IC FLASH 32MBIT PAR 48TSOP I
Packaging and Encapsulation   48-TFSOP（0.724"，18.40mm 宽）
Describe  
 
 
 
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