LE25S81FDTWG
Die&wafer services
onsemiBrandedLE25S81FDTWGIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use8-SOIC（0.154"，3.90mm 宽）Packaging technology，nowLE25S81FDTWGChip inventory is19753individual。
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