LE25FU406BMB-TLM-H
Die&wafer services
onsemiBrandedLE25FU406BMB-TLM-HIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use8-SOIC(0.154",3.90mm 宽)Packaging technology,nowLE25FU406BMB-TLM-HChip inventory is15126individual。
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