Image


NAND01GR3B2CZA6E

Die&wafer services

    Micron Technology Inc.BrandedNAND01GR3B2CZA6EIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use63-TFBGAPackaging technology,nowNAND01GR3B2CZA6EChip inventory is17781individual。
---
 
Die&wafer services

NAND01GR3B2CZA6E

查看芯片与晶圆服务型号为NAND01GR3B2CZA6E,品牌为Micron的大图  
 
NAND01GR3B2CZA6E     There is sufficient supply and supply is ongoing...
Chip Information    
Model   NAND01GR3B2CZA6E
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   17781
 Inquiry Now
Characteristic    
Minqty   1
Series   IC FLASH 1GBIT PARALLEL 63VFBGA
Packaging and Encapsulation   63-TFBGA
Describe  
 
 
 
  •               Previous article
    MT29F8G16ABACAH4:C
    Micron Technology Inc.
    闪存 - NAND
  •               Next article
    CY7C1312SV18-167BZC
    Infineon Technologies
    SRAM - 同步,QDR II...
  •  
     
    BRAND
     
  •  
    BROADCOM
    1
     
     
  •  
    STMicroelectronics
    2
     
     
  •  
    XILINX
    3
     
     
  •  
    ON Semiconductor
    4
     
     
  •  
    Maxim
    5
     
     
  •  
    ALTERA
    6
     
     
  •  
    Texas Instruments
    7
     
     
  •  
    NXP Semiconductors
    8
     
     
  •  
    Microchip
    9
     
     
  •  
    Silicon Labs
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd