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MT29F32G08CBADAWP:D

Die&wafer services

    Micron Technology Inc.BrandedMT29F32G08CBADAWP:DIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowMT29F32G08CBADAWP:DChip inventory is17339individual。
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Die&wafer services

MT29F32G08CBADAWP:D
查看芯片与晶圆服务型号为MT29F32G08CBADAWP:D，品牌为Micron的大图  
 
MT29F32G08CBADAWP:D     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MT29F32G08CBADAWP:D
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   17339
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Characteristic    
Minqty   1
Series   IC FLASH 32GBIT PAR 48TSOP I
Packaging and Encapsulation   48-TFSOP（0.724"，18.40mm 宽）
Describe  
 
 
 
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