NAND08GW3C2BN6E
Die&wafer services
Micron Technology Inc.BrandedNAND08GW3C2BN6EIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowNAND08GW3C2BN6EChip inventory is12939individual。
---
