NAND02GR3B2DN6E
Die&wafer services
Micron Technology Inc.BrandedNAND02GR3B2DN6EIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowNAND02GR3B2DN6EChip inventory is14227individual。
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