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NAND01GW3B2CZA6E

Die&wafer services

    Micron Technology Inc.BrandedNAND01GW3B2CZA6EIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use63-TFBGAPackaging technology,nowNAND01GW3B2CZA6EChip inventory is19670individual。
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Die&wafer services

NAND01GW3B2CZA6E

查看芯片与晶圆服务型号为NAND01GW3B2CZA6E,品牌为Micron的大图  
 
NAND01GW3B2CZA6E     There is sufficient supply and supply is ongoing...
Chip Information    
Model   NAND01GW3B2CZA6E
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   19670
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Characteristic    
Minqty   1
Series   IC FLASH 1GBIT PARALLEL 63VFBGA
Packaging and Encapsulation   63-TFBGA
Describe  
 
 
 
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