Image


IDT71V35761S200BQG8

Die&wafer services

    Renesas Electronics America IncBrandedIDT71V35761S200BQG8Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use165-TBGAPackaging technology，nowIDT71V35761S200BQG8Chip inventory is14110individual。
---
 
Die&wafer services

IDT71V35761S200BQG8
查看芯片与晶圆服务型号为IDT71V35761S200BQG8，品牌为Renesas的大图  
 
IDT71V35761S200BQG8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   IDT71V35761S200BQG8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   14110
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 4.5MBIT PAR 165CABGA
Packaging and Encapsulation   165-TBGA
Describe  
 
 
 
  •               Previous article
    23LCV1024-E&SN
    Microchip Technology
    SRAM - 同步
  •               Next article
    IDT71V3556S166BGI
    Renesas Electronics America Inc
    SRAM - 同步，SDR（ZBT）...
    •  
     
    BRAND
     
  •  
    Maxim
    1
     
     
  •  
    Texas Instruments
    2
     
     
  •  
    STMicroelectronics
    3
     
     
  •  
    ON Semiconductor
    4
     
     
  •  
    Analog Devices Inc
    5
     
     
  •  
    XILINX
    6
     
     
  •  
    Microchip
    7
     
     
  •  
    ALTERA
    8
     
     
  •  
    Silicon Labs
    9
     
     
  •  
    NXP Semiconductors
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd