Image


IDT71V35761S200BQ8

Die&wafer services

    Renesas Electronics America IncBrandedIDT71V35761S200BQ8Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use165-TBGAPackaging technology,nowIDT71V35761S200BQ8Chip inventory is19959individual。
---
 
Die&wafer services

IDT71V35761S200BQ8

查看芯片与晶圆服务型号为IDT71V35761S200BQ8,品牌为Renesas的大图  
 
IDT71V35761S200BQ8     There is sufficient supply and supply is ongoing...
Chip Information    
Model   IDT71V35761S200BQ8
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19959
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 4.5MBIT PAR 165CABGA
Packaging and Encapsulation   165-TBGA
Describe  
 
 
 
  •               Previous article
    SST39VF1601C-70-4I-B3KE-MCF-T
    Microchip Technology
    闪存
  •               Next article
    IDT71V3556S166BG
    Renesas Electronics America Inc
    SRAM - 同步,SDR(ZBT)...
  •  
     
    BRAND
     
  •  
    Analog Devices Inc
    1
     
     
  •  
    Silicon Labs
    2
     
     
  •  
    XILINX
    3
     
     
  •  
    STMicroelectronics
    4
     
     
  •  
    Microchip
    5
     
     
  •  
    NXP Semiconductors
    6
     
     
  •  
    Texas Instruments
    7
     
     
  •  
    ALTERA
    8
     
     
  •  
    Maxim
    9
     
     
  •  
    BROADCOM
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd