Image


IDT71V35761S200BQ

Die&wafer services

    Renesas Electronics America IncBrandedIDT71V35761S200BQIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use165-TBGAPackaging technology，nowIDT71V35761S200BQChip inventory is11926individual。
---
 
Die&wafer services

IDT71V35761S200BQ
查看芯片与晶圆服务型号为IDT71V35761S200BQ，品牌为Renesas的大图  
 
IDT71V35761S200BQ     There is sufficient supply and supply is ongoing...
Chip Information    
Model   IDT71V35761S200BQ
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11926
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 4.5MBIT PAR 165CABGA
Packaging and Encapsulation   165-TBGA
Describe  
 
 
 
  •               Previous article
    23LCV512T-E&ST
    Microchip Technology
    SRAM - 同步
  •               Next article
    IDT71V3556S150PF8
    Renesas Electronics America Inc
    SRAM - 同步，SDR（ZBT）...
    •  
     
    BRAND
     
  •  
    Texas Instruments
    1
     
     
  •  
    Maxim
    2
     
     
  •  
    STMicroelectronics
    3
     
     
  •  
    ALTERA
    4
     
     
  •  
    ON Semiconductor
    5
     
     
  •  
    NXP Semiconductors
    6
     
     
  •  
    Analog Devices Inc
    7
     
     
  •  
    Microchip
    8
     
     
  •  
    Silicon Labs
    9
     
     
  •  
    XILINX
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd