Image


71V35761S200BGGI

Die&wafer services

    Renesas Electronics America IncBranded71V35761S200BGGIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use119-BGAPackaging technology，now71V35761S200BGGIChip inventory is13845individual。
---
 
Die&wafer services

71V35761S200BGGI
查看芯片与晶圆服务型号为71V35761S200BGGI，品牌为Renesas的大图  
 
71V35761S200BGGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   71V35761S200BGGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   13845
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 4.5MBIT PAR 119PBGA
Packaging and Encapsulation   119-BGA
Describe  
 
 
 
  •               Previous article
    M24C16-RMB6TG
    STMicroelectronics
    EEPROM
  •               Next article
    IDT71V3556S150BG8
    Renesas Electronics America Inc
    SRAM - 同步，SDR（ZBT）...
    •  
     
    BRAND
     
  •  
    Silicon Labs
    1
     
     
  •  
    Texas Instruments
    2
     
     
  •  
    Microchip
    3
     
     
  •  
    Maxim
    4
     
     
  •  
    XILINX
    5
     
     
  •  
    STMicroelectronics
    6
     
     
  •  
    BROADCOM
    7
     
     
  •  
    NXP Semiconductors
    8
     
     
  •  
    Analog Devices Inc
    9
     
     
  •  
    ON Semiconductor
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd