Image


71V35761SA200BGGI

Die&wafer services

    Renesas Electronics America IncBranded71V35761SA200BGGIIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use119-BGAPackaging technology，now71V35761SA200BGGIChip inventory is16865individual。
---
 
Die&wafer services

71V35761SA200BGGI
查看芯片与晶圆服务型号为71V35761SA200BGGI，品牌为Renesas的大图  
 
71V35761SA200BGGI     There is sufficient supply and supply is ongoing...
Chip Information    
Model   71V35761SA200BGGI
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   16865
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 4.5MBIT PAR 119PBGA
Packaging and Encapsulation   119-BGA
Describe  
 
 
 
  •               Previous article
    IDT71V25761S200PFI8
    Renesas Electronics America Inc
    SRAM - 同步，SDR
  •               Next article
    IDT71P74604S167BQ
    Renesas Electronics America Inc
    SRAM - 同步，QDR II...
    •  
     
    BRAND
     
  •  
    Maxim
    1
     
     
  •  
    Microchip
    2
     
     
  •  
    BROADCOM
    3
     
     
  •  
    ON Semiconductor
    4
     
     
  •  
    ALTERA
    5
     
     
  •  
    Silicon Labs
    6
     
     
  •  
    XILINX
    7
     
     
  •  
    NXP Semiconductors
    8
     
     
  •  
    STMicroelectronics
    9
     
     
  •  
    Texas Instruments
    10
     
     
    •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd