Image


MR0A08BCSO35

Die&wafer services

    Everspin Technologies Inc.BrandedMR0A08BCSO35Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use32-SOIC(0.295",7.50mm 宽)Packaging technology,nowMR0A08BCSO35Chip inventory is18624individual。
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Die&wafer services

MR0A08BCSO35

查看芯片与晶圆服务型号为MR0A08BCSO35,品牌为Everspin的大图  
 
MR0A08BCSO35     There is sufficient supply and supply is ongoing...
Chip Information    
Model   MR0A08BCSO35
Brand   Everspin
Manufacturer   Everspin Technologies Inc.
PDF   Viewing PDF files
Inventory quantity   18624
 Inquiry Now
Characteristic    
Minqty   1
Series   IC RAM 1MBIT PARALLEL 32SOIC
Packaging and Encapsulation   32-SOIC(0.295",7.50mm 宽)
Describe  
 
 
 
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