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7027L25G

Die&wafer services

    Renesas Electronics America IncBranded7027L25GIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use108-BPGAPackaging technology,now7027L25GChip inventory is19032individual。
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Die&wafer services

7027L25G

查看芯片与晶圆服务型号为7027L25G,品牌为Renesas的大图  
 
7027L25G     There is sufficient supply and supply is ongoing...
Chip Information    
Model   7027L25G
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   19032
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Characteristic    
Minqty   1
Series   IC SRAM 512KBIT PARALLEL 108PGA
Packaging and Encapsulation   108-BPGA
Describe  
 
 
 
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