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IDT70824S25G

Die&wafer services

    Renesas Electronics America IncBrandedIDT70824S25GIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use84-BPGAPackaging technology，nowIDT70824S25GChip inventory is15955individual。
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Die&wafer services

IDT70824S25G
查看芯片与晶圆服务型号为IDT70824S25G，品牌为Renesas的大图  
 
IDT70824S25G     There is sufficient supply and supply is ongoing...
Chip Information    
Model   IDT70824S25G
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   15955
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Characteristic    
Minqty   1
Series   IC RAM 64KBIT PARALLEL 84PGA
Packaging and Encapsulation   84-BPGA
Describe  
 
 
 
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