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CYD36S72V18-200BGXC

Die&wafer services

    Infineon TechnologiesBrandedCYD36S72V18-200BGXCIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use484-FBGAPackaging technology，nowCYD36S72V18-200BGXCChip inventory is18887individual。
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Die&wafer services

CYD36S72V18-200BGXC
查看芯片与晶圆服务型号为CYD36S72V18-200BGXC，品牌为Infineon的大图  
 
CYD36S72V18-200BGXC     There is sufficient supply and supply is ongoing...
Chip Information    
Model   CYD36S72V18-200BGXC
Brand   Infineon
Manufacturer   Infineon Technologies
PDF   Viewing PDF files
Inventory quantity   18887
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Characteristic    
Minqty   1
Series   IC SRAM 36MBIT PARALLEL 484PBGA
Packaging and Encapsulation   484-FBGA
Describe  
 
 
 
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