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CYD36S18V18-167BGXC

Die&wafer services

    Infineon TechnologiesBrandedCYD36S18V18-167BGXCIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use484-FBGAPackaging technology，nowCYD36S18V18-167BGXCChip inventory is18911individual。
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Die&wafer services

CYD36S18V18-167BGXC
查看芯片与晶圆服务型号为CYD36S18V18-167BGXC，品牌为Infineon的大图  
 
CYD36S18V18-167BGXC     There is sufficient supply and supply is ongoing...
Chip Information    
Model   CYD36S18V18-167BGXC
Brand   Infineon
Manufacturer   Infineon Technologies
PDF   Viewing PDF files
Inventory quantity   18911
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Characteristic    
Minqty   1
Series   IC SRAM 36MBIT PAR 484PBGA
Packaging and Encapsulation   484-FBGA
Describe  
 
 
 
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