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TE28F256P30BFA

Die&wafer services

    Micron Technology Inc.BrandedTE28F256P30BFAIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use56-TFSOP(0.724",18.40mm 宽)Packaging technology,nowTE28F256P30BFAChip inventory is13299individual。
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Die&wafer services

TE28F256P30BFA

查看芯片与晶圆服务型号为TE28F256P30BFA,品牌为Micron的大图  
 
TE28F256P30BFA     There is sufficient supply and supply is ongoing...
Chip Information    
Model   TE28F256P30BFA
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   13299
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Characteristic    
Minqty   1
Series   IC FLASH 256MBIT PAR 56TSOP
Packaging and Encapsulation   56-TFSOP(0.724",18.40mm 宽)
Describe  
 
 
 
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