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70T3589S166DR

Die&wafer services

    Renesas Electronics America IncBranded70T3589S166DRIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use208-BFQFPPackaging technology，now70T3589S166DRChip inventory is10362individual。
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Die&wafer services

70T3589S166DR
查看芯片与晶圆服务型号为70T3589S166DR，品牌为Renesas的大图  
 
70T3589S166DR     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70T3589S166DR
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   10362
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Characteristic    
Minqty   1
Series   IC SRAM 2MBIT PARALLEL 208PQFP
Packaging and Encapsulation   208-BFQFP
Describe  
 
 
 
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