Image


IDT70P3537S250RM

Die&wafer services

    Renesas Electronics America IncBrandedIDT70P3537S250RMIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use576-BBGA,FCBGAPackaging technology,nowIDT70P3537S250RMChip inventory is11934individual。
---
 
Die&wafer services

IDT70P3537S250RM

查看芯片与晶圆服务型号为IDT70P3537S250RM,品牌为Renesas的大图  
 
IDT70P3537S250RM     There is sufficient supply and supply is ongoing...
Chip Information    
Model   IDT70P3537S250RM
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   11934
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 18MBIT PAR 576FCBGA
Packaging and Encapsulation   576-BBGA,FCBGA
Describe  
 
 
 
  •               Previous article
    TE28F640P30T85A
    Micron Technology Inc.
    FLASH - NOR
  •               Next article
    CYD04S72V-133BBI
    Infineon Technologies
    SRAM - 双端口,同步...
  •  
     
    BRAND
     
  •  
    Maxim
    1
     
     
  •  
    Silicon Labs
    2
     
     
  •  
    BROADCOM
    3
     
     
  •  
    Analog Devices Inc
    4
     
     
  •  
    NXP Semiconductors
    5
     
     
  •  
    ALTERA
    6
     
     
  •  
    XILINX
    7
     
     
  •  
    STMicroelectronics
    8
     
     
  •  
    Texas Instruments
    9
     
     
  •  
    ON Semiconductor
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd