Image


70P3519S166BCG

Die&wafer services

    Renesas Electronics America IncBranded70P3519S166BCGIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use256-LBGAPackaging technology,now70P3519S166BCGChip inventory is17807individual。
---
 
Die&wafer services

70P3519S166BCG

查看芯片与晶圆服务型号为70P3519S166BCG,品牌为Renesas的大图  
 
70P3519S166BCG     There is sufficient supply and supply is ongoing...
Chip Information    
Model   70P3519S166BCG
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   17807
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 9MBIT PARALLEL 256CABGA
Packaging and Encapsulation   256-LBGA
Describe  
 
 
 
  •               Previous article
    CY7C192-15VXCT
    Infineon Technologies
    SRAM - 异步
  •               Next article
    CY7C1318CV18-278BZXC
    Infineon Technologies
    SRAM - 同步,DDR II...
  •  
     
    BRAND
     
  •  
    XILINX
    1
     
     
  •  
    NXP Semiconductors
    2
     
     
  •  
    Analog Devices Inc
    3
     
     
  •  
    Silicon Labs
    4
     
     
  •  
    ALTERA
    5
     
     
  •  
    ON Semiconductor
    6
     
     
  •  
    Texas Instruments
    7
     
     
  •  
    STMicroelectronics
    8
     
     
  •  
    BROADCOM
    9
     
     
  •  
    Microchip
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd