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IDT70P3307S233RM

Die&wafer services

    Renesas Electronics America IncBrandedIDT70P3307S233RMIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use576-BBGA，FCBGAPackaging technology，nowIDT70P3307S233RMChip inventory is18583individual。
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Die&wafer services

IDT70P3307S233RM
查看芯片与晶圆服务型号为IDT70P3307S233RM，品牌为Renesas的大图  
 
IDT70P3307S233RM     There is sufficient supply and supply is ongoing...
Chip Information    
Model   IDT70P3307S233RM
Brand   Renesas
Manufacturer   Renesas Electronics America Inc
PDF   Viewing PDF files
Inventory quantity   18583
 Inquiry Now
Characteristic    
Minqty   1
Series   IC SRAM 18MBIT PAR 576FCBGA
Packaging and Encapsulation   576-BBGA，FCBGA
Describe  
 
 
 
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