Image


NAND256R3A2BZA6E

Die&wafer services

    Micron Technology Inc.BrandedNAND256R3A2BZA6EIntegrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use55-TFBGAPackaging technology,nowNAND256R3A2BZA6EChip inventory is12463individual。
---
 
Die&wafer services

NAND256R3A2BZA6E

查看芯片与晶圆服务型号为NAND256R3A2BZA6E,品牌为Micron的大图  
 
NAND256R3A2BZA6E     There is sufficient supply and supply is ongoing...
Chip Information    
Model   NAND256R3A2BZA6E
Brand   Micron
Manufacturer   Micron Technology Inc.
PDF   Viewing PDF files
Inventory quantity   12463
 Inquiry Now
Characteristic    
Minqty   1
Series   IC FLASH 256MBIT PAR 55VFBGA
Packaging and Encapsulation   55-TFBGA
Describe  
 
 
 
  •               Previous article
    M29W400DT70ZE6E
    Micron Technology Inc.
    FLASH - NOR
  •               Next article
    IDT71V416L12Y8
    Renesas Electronics America Inc
    SRAM - 异步
  •  
     
    BRAND
     
  •  
    XILINX
    1
     
     
  •  
    NXP Semiconductors
    2
     
     
  •  
    STMicroelectronics
    3
     
     
  •  
    Silicon Labs
    4
     
     
  •  
    ALTERA
    5
     
     
  •  
    Microchip
    6
     
     
  •  
    ON Semiconductor
    7
     
     
  •  
    BROADCOM
    8
     
     
  •  
    Texas Instruments
    9
     
     
  •  
    Maxim
    10
     
     
  •  
    CopyRight 2023 © Shenzhen Victorystar Technology Co., Ltd. All Right Reserved Yue ICP Preparation No. 2022071625
    Address: 1809, Block A, Jiahe Building, Zhonghang Road, Futian District, Shenzhen Zip code: 518000 Company Tel.: (86) 0755-88896989 Fax: 0755-83868885
    Copyright Shenzhen Victorystar Technology Co., Ltd

    Copyright Shenzhen Victorystar Technology Co., Ltd