M29DW323DB70N6
Die&wafer services
Micron Technology Inc.BrandedM29DW323DB70N6Integrated circuit electronic chips use1Encapsulated, with a working temperature range of,The voltage is,use48-TFSOP（0.724"，18.40mm 宽）Packaging technology，nowM29DW323DB70N6Chip inventory is17816individual。
---
